Honor’s Latest Magic6 Series Flagship Phones Launched In China

The flagship phones from Honor in 2024 redefine hardware standards. The Honor Magic6 and Magic6 Pro showcase Qualcomm’s top-tier Snapdragon 8 Gen 3 chip, captivating LTPO OLED displays, and remarkable triple cameras. The Pro variant steals the spotlight with a 180MP periscope lens. Both phones boast 6.8-inch curved LTPO AMOLEDs, featuring a flexible 1-120Hz refresh rate. Honor emphasizes a peak brightness of 1,800nits in auto mode and an astounding 5,000nits for HDR content. The displays incorporate 4,320Hz ultra-high frequency PWM dimming and house a 50MP front-facing camera with f/2.0 aperture. While the Magic6 sports a single punch hole cutout, the Pro version adds a pill for the 3D depth face unlock module.

The rear design showcases a revamped camera island, featuring a 50MP main cam with f/1.4-f/2.0 variable aperture on the Magic6 Pro and a 50MP f/1.9 shooter on the Magic6. Notably, the Pro model introduces a groundbreaking 180MP periscope lens with 2.5x optical zoom and up to 100x digital zoom, alongside a 50MP ultrawide lens. The non-Pro variant is equipped with a 32MP telephoto lens with 2.5x optical and 50x digital zoom, accompanied by a 50MP ultrawide lens. Both phones run on Honor’s latest MagicOS 8.0, based on Android 14, offering options of 12GB or 16GB RAM and up to 1TB storage for the Pro model. Powering the Magic6 is a 5,450mAh battery with 66W wired charging and 50W wireless charging using Honor’s proprietary wireless charger. The Pro model steps up with a 5,600mAh cell, supporting 80W wired and 66W wireless charging. Impressive connectivity features include Wi-Fi 7 and Bluetooth 5.3, with the Magic6 Pro gaining satellite connectivity in China. Both devices include IR blasters for home appliance control and boast IP68 dustproof and water-resistant ratings. Honor continues to push boundaries, offering a stellar combination of cutting-edge technology and design in their flagship smartphones.


Leave a Reply

Your email address will not be published. Required fields are marked *